ADHESIVE FILM COMPOSITION FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An adhesive film for a semiconductor package is provided to have a low mobility at high temperature by a crosslinking reaction of a carboxyl group-containing acrylic copolymer after a die attach cure process, and to prevent bonding defects and chip cracks due to bouncing. CONSTITUTION: An adhesive film for a semiconductor package comprises a substrate layer(1), an adhesive layer(2), and a bonding layer(3). The bonding layer comprises a thermoplastic resin which includes an epoxy group-containing acrylic copolymer, and thermoplastic resin which comprises a carboxyl group-containing acrylic copolymer; epoxy-based resin with a softening point of 30-100°C, a phenol resin hardening agent, a hardening accelerator, and an inorganic filler. The thermoplastic resin comprises 1-7 weight% of an epoxy group-containing acrylic copolymer which contains glycidyl acrylate or glycidyl methacrylate; and 1-7 weight% of a carboxyl group-containing acrylic copolymer which contains methacrylic acid.