It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal (20) via a nickel plating layer (21) in a terminal contact portion (11) to be held in contact with a mating terminal. A tin plating layer (23) is formed on the base metal (20) without via the nickel plating layer (21) in a wire crimping portion (12) to be crimped and connected to a core (15) of an insulated wire (14).
