发明名称 |
Integrated circuit packaging system with package stacking and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system including: fabricating a base package substrate having component pads and stacking pads; coupling a base integrated circuit die to the component pads; forming a penetrable encapsulation material for enclosing the base integrated circuit die and the component pads on the base package substrate; and coupling stacked interconnects on the stacking pads adjacent to and not contacting the penetrable encapsulation material.
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申请公布号 |
US8404518(B2) |
申请公布日期 |
2013.03.26 |
申请号 |
US20090636779 |
申请日期 |
2009.12.13 |
申请人 |
DO BYUNG TAI;HUANG RUI;PAGAILA REZA ARGENTY;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;HUANG RUI;PAGAILA REZA ARGENTY |
分类号 |
H01L21/50;H01L21/44;H01L21/48;H01L23/02;H01L23/52;H01L27/146 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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