发明名称 Method of manufacturing hollow microneedle structures
摘要 Provided is a method of manufacturing a hollow microneedle structure. The method includes coating a hollow core having a predetermined section and being long in a lengthwise direction with a coating solution, and solidifying the coating solution to form a coating layer, depositing a metal seed layer on the coating layer, plating the seed metal layer with a metal to form a plated layer, cutting the hollow core having the plated layer at an inclination angle with respect to the lengthwise direction for form a surface inclination, and removing the hollow core and the coating layer to form a hollow microneedle structure. Thus, the hollow microneedle structure can be manufactured to have such diameter, length, hardness, and inclination angle as to minimize pain. By use of the hollow core, the microneedle structure can have vertical microneedles with a uniform inner diameter.
申请公布号 US8402629(B2) 申请公布日期 2013.03.26
申请号 US20090635480 申请日期 2009.12.10
申请人 LEE DAE SIK;YOON YONG SUN;JUNG MOON YOUN;PARK SEON HEE;ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 LEE DAE SIK;YOON YONG SUN;JUNG MOON YOUN;PARK SEON HEE
分类号 B23P25/00;A61M5/32;B05D3/12;B22D11/126 主分类号 B23P25/00
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