发明名称 Highly dilutable polishing concentrates and slurries
摘要 The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
申请公布号 US8404143(B2) 申请公布日期 2013.03.26
申请号 US201213402365 申请日期 2012.02.22
申请人 KIM HYUNGJUN;WEN RICHARD;HU BIN;TANAKA MINAE;MAHULIKAR DEEPAK;FUJIFILM PLANAR SOLUTIONS, LLC 发明人 KIM HYUNGJUN;WEN RICHARD;HU BIN;TANAKA MINAE;MAHULIKAR DEEPAK
分类号 C09K13/00 主分类号 C09K13/00
代理机构 代理人
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