发明名称 |
Heat sink integrated power delivery and distribution for integrated circuits |
摘要 |
A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer. |
申请公布号 |
US8405998(B2) |
申请公布日期 |
2013.03.26 |
申请号 |
US20100914697 |
申请日期 |
2010.10.28 |
申请人 |
BAROWSKI HARRY;BRUNSCHWILER THOMAS;HARRER HUBERT;HUBER ANDREAS;MICHEL BRUNO;NIGGEMEIER TIM;PAREDES STEPHAN;SUPPER JOCHEN;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAROWSKI HARRY;BRUNSCHWILER THOMAS;HARRER HUBERT;HUBER ANDREAS;MICHEL BRUNO;NIGGEMEIER TIM;PAREDES STEPHAN;SUPPER JOCHEN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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