POWER MODULE PACKAGE

摘要

PURPOSE: A power mobile package is provided to connect electrically a control device and a power device through a pad and to reduce manufacturing costs. CONSTITUTION: A first substrate touches a second substrate. A first lead frame(151) touches a part of the first substrate. A first metal layer(123) is formed in the first substrate. A first bonding layer(133) touches the lower side of the second substrate. A second metal layer(121) is formed on the first substrate. A second bonding layer(131) touches the lower side of the first lead frame.