发明名称 Interconnect architecture in three dimensional network on a chip
摘要 The connection architecture of a network on a chip (NoC) is described in which (a) nodes in octahedron sections are connected in an arc Benes network, (b) a hierarchy of node clusters are connected using a globally asynchronous locally asynchronous (GALA) configuration, (c) a double wishbone 2D torus ring is applied to connection between network layers and (d) data is routed using buffer modulation.
申请公布号 US8407660(B2) 申请公布日期 2013.03.26
申请号 US20080283576 申请日期 2008.09.12
申请人 SOLOMON NEAL 发明人 SOLOMON NEAL
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
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