发明名称 Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
摘要 Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.
申请公布号 US8404769(B2) 申请公布日期 2013.03.26
申请号 US20080596165 申请日期 2008.04.25
申请人 FUJIMOTO DAISUKE;MIZUNO YASUYUKI;DANJOUBARA KAZUTOSHI;MURAI HIKARI;HITACHI CHEMICAL COMPANY, LTD. 发明人 FUJIMOTO DAISUKE;MIZUNO YASUYUKI;DANJOUBARA KAZUTOSHI;MURAI HIKARI
分类号 C08K3/26;B32B15/08 主分类号 C08K3/26
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