发明名称 |
Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module |
摘要 |
An improvement is achieved in the mounting reliability of a semiconductor device. A semiconductor chip is mounted over an upper surface of a wiring substrate. A plurality of solder balls are disposed individually over a plurality of lands formed on a lower surface of the wiring substrate. The plural lands include a first land group arranged in a plurality of rows and arranged along a peripheral edge portion of the lower surface of the wiring substrate, and a second land group arranged inside the first land group in the lower surface of the wiring substrate. The lands in the first land group are arranged with a first pitch, and the lands in the second land group are arranged with a second pitch higher than the first pitch.
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申请公布号 |
US8405231(B2) |
申请公布日期 |
2013.03.26 |
申请号 |
US201113289593 |
申请日期 |
2011.11.04 |
申请人 |
HAYASHI YOSHINARI;RENESAS ELECTRONICS CORPORATION |
发明人 |
HAYASHI YOSHINARI |
分类号 |
H01L23/42;H01L23/58 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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