发明名称 |
Miniature microphone assembly with solder sealing ring |
摘要 |
The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal. |
申请公布号 |
US8406437(B2) |
申请公布日期 |
2013.03.26 |
申请号 |
US20090389011 |
申请日期 |
2009.02.19 |
申请人 |
JOHANSEN LEIF STEEN;HOEVESTEN PER F.;ROCCA GINO;EPCOS PTE LTD |
发明人 |
JOHANSEN LEIF STEEN;HOEVESTEN PER F.;ROCCA GINO |
分类号 |
H04R25/00 |
主分类号 |
H04R25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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