| 摘要 |
Disclosed is a bonding substrate manufacturing apparatus for manufacturing a bonding substrate by bonding an upper substrate and a lower substrate while aligning the upper and the lower substrates with each other. The apparatus is provided with a placing table for placing the lower substrate, a moving mechanism for moving the placing table, a base section whereupon the moving mechanism is arranged, a supporting bar arranged upright on the base section, and an upper pressurizing member which can vertically move along the supporting bar and hold the upper substrate. The upper substrate held by the upper pressurizing member and the lower substrate placed on the placing table are bonded to each other by bringing down the upper pressurizing member. |
