发明名称 High performance MOSFET comprising a stressed gate metal silicide layer and method of fabricating the same
摘要 The present invention relates to a semiconductor device that comprises at least one field effect transistor (FET) containing a source region, a drain region, a channel region, a gate dielectric layer, a gate electrode, and one or more gate sidewall spacers. The gate electrode of such an FET contains an intrinsically stressed gate metal silicide layer, which is laterally confined by one or more gate sidewall spacers and is arranged and constructed for creating stress in the channel region of the FET. Preferably, the semiconductor device comprises at least one p-channel FET, and more preferably, the p-channel FET has a gate electrode with an intrinsically stressed gate metal silicide layer that is laterally confined by one or more gate sidewall spacers and is arranged and constructed for creating compressive stress in the p-channel of the FET.
申请公布号 US8405131(B2) 申请公布日期 2013.03.26
申请号 US20080342677 申请日期 2008.12.23
申请人 YANG HAINING S.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 YANG HAINING S.
分类号 H01L29/76;H01L21/8238 主分类号 H01L29/76
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