| 摘要 |
Disclosed is a process for producing a bonded material in which a first circuit member and a second circuit member are electrically bonded to each other through an anisotropic conductive film comprising electrically conductive particles and a photocurable resin. The process comprises the steps of: arranging the first circuit member, the anisotropic conductive film and the second circuit member in this order; pressure-welding the first circuit member to the second circuit member through the anisotropic conductive film while applying an ultrasonic wave; and, subsequent to the application of the ultrasonic wave, irradiating the anisotropic conductive film with light while carrying out the pressure-welding of the first circuit member to the second circuit member through the anisotropic conductive film.
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