| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vacuum thermal bonding device capable of adjusting minute pressing force while preventing an air from mixing into an adhesive layer under vacuum state and forming the adhesive layer with a suitable thickness by restraining an adhesive from sticking out under an adequately pressurized state and bonding an element with a board under a vacuum-heating state. <P>SOLUTION: In the vacuum thermal bonding device, a vacuum partition is internally formed by airtightly slide-sealing a lower end of an upper frame member 12 to the circumference of a lower plate member 6 with a drive unit, a pressure peel-off film is softened by heating under atmospheric pressure while keeping touched with an upper face of an element, and an outer peripheral section of the pressure peel-off film is airtightly retained between the upper face of a board setting base of the lower plate member 6 and the lower face of an internal frame body 13 while a vacuum chamber is set to be internally vacuum and the lower plate member 6 and an intermediate member 10 are relatively moved in a direction wherein both members come close each other. Then, the pressure peel-off film is stuck to the outer surface of the board and the element in order to join the element with the board by applying the atmospheric pressure or pressure higher than the atmospheric pressure to an upper space of the pressure peel-off film in the vacuum chamber. <P>COPYRIGHT: (C)2013,JPO&INPIT |
