| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good heat resistance, heat conductivity and besides good appearance. <P>SOLUTION: The polyamide resin composition contains a polyamide (A) comprising a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component, and a heat-conductive filler (B), wherein the volume ratio (A/B) of (A) and (B) is 30/70 to 90/10; a triamine unit to a diamine unit in the polyamide (A) is ≤0.3 mol%; and the straight-chain aliphatic diamine is 1,10-decanediamine. <P>COPYRIGHT: (C)2013,JPO&INPIT |
