发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
摘要 <P>PROBLEM TO BE SOLVED: To provide a technique capable of suppressing degradation in process efficiency when a trouble occurs at a liquid process part, relating to a liquid process device including a liquid process part that contains a plurality of nozzles prepared for each type of process liquid corresponding to a lot of substrates. <P>SOLUTION: In a case where a trouble occurs with a chemical liquid nozzle 25a which is used for liquid processing of a wafer W in a certain lot, using of the chemical liquid nozzle 25a corresponding to the lot is stopped, and processing is performed for a next lot for which a chemical liquid nozzle 25b which is different from the chemical liquid nozzle 25a is used for processing. A liquid process state of each wafer W that has been processed is sequentially inspected for determining soundness. If wafers W processed at liquid process parts COT1-COT3, different from each other, by using the same chemical liquid nozzle are determined to be defective, for example, three times in succession, it is determined that a trouble has occurred at the chemical liquid nozzle. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013055191(A) 申请公布日期 2013.03.21
申请号 JP20110191684 申请日期 2011.09.02
申请人 TOKYO ELECTRON LTD 发明人 NAKAJIMA TAKEHIRO;INOUE SHIN;HARA YOSHITAKA;HASEGAWA IZUMI;OGATA KUNIE;MORI TAKUYA
分类号 H01L21/027;H01L21/677 主分类号 H01L21/027
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