| 摘要 |
A method for manufacturing a lead frame structure(lOO) for semiconductor packaging includes providing a metal substrate and performing an etching process on the top surface and the back surface of the metal substrate simultaneously using a top surface etching pattern and a back surface etching pattern as the respective masks to form etched regions in the metal substrate, an island(l), and a plurality of leads(2). Further, the method includes placing the etched metal substrate in a mold, and encapsulating the etched metal substrate using the mold such that a molding compound(4) is filled in the etched regions, areas between the island and the plurality of leads, and areas between the plurality of leads, while exposing the top surfaces and the back surfaces of the island and the plurality of leads. The method also includes performing a plating process on the encapsulated metal substrate to form a first metal layer(5) on the exposed top surfaces of the island and the plurality of leads, and a second metal layer(6) on the exposed back surfaces of the island and the plurality of leads. |
