COMBINATION OF FRAME BODY AND ELECTRONIC COMPONENT, METHOD OF MANUFACTURING FRAME BODY AND ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING CARD

摘要

PROBLEM TO BE SOLVED: To provide a combination of a frame body and an electronic component which can reduce a level difference on a card surface, a method of manufacturing a frame body and an electronic component, and a method of manufacturing a card.

SOLUTION: An assembly 30 is a combination of a frame body 31 and an electronic module 10 which are manufactured in a process of manufacturing a card 40. The assembly 30 has the frame body 31 having a pore 32 larger than a card outer shape 40c of the manufactured card 40, and the electronic module 10 which is held with respect to the frame body 31 in a state of being arranged at a predetermined position of the pore 32.

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