METAL BASE FOR THIN FILM SUPERCONDUCTIVE WIRE ROD, MANUFACTURING METHOD OF METAL BASE FOR THIN FILM SUPERCONDUCTIVE WIRE ROD, AND MANUFACTURING METHOD OF THIN FILM SUPERCONDUCTIVE WIRE ROD

摘要

PROBLEM TO BE SOLVED: To provide a metal base for a thin film superconductive wire rod which inhibits the occurrence of the warpage due to a thermal contraction difference between a metal substrate and an intermediate layer even when formed into a wide shape where the intermediate layer is formed on the wide metal substrate and also inhibits the occurrence of defects in the subsequent processes, the oxide superconductive layer formation process, the stabilization layer formation process, and the thin film superconductive wire rod thinning process, and to provide a manufacturing method of the metal base for the thin film superconductive wire rod and a manufacturing method of the thin film superconductive wire rod.

SOLUTION: A metal base for a thin film superconductive wire rod has an orientational ceramic layer located on a surface of a metal substrate and has a non orientational ceramic layer located on a rear surface of the metal substrate. A manufacturing method of the metal base for the thin film superconductive wire rod includes: a process where the metal substrate is heated in a deposition system and the orientational ceramic layer is formed on the surface of the metal substrate; a process where the metal substrate is heated in the deposition system and the non orientational ceramic layer is formed on the rear surface of the metal substrate; a process that is performed between the above processes and where the metal substrate on which the orientational ceramic layer or the non orientational ceramic layer is formed is taken out from the deposition system to be cooled. The metal base for the thin film superconductive wire rod is manufactured through these processes.

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