| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a printed circuit board having a through via for soldering which prevents clogging of a solder resist layer material itself in the via at the time of solder resist layer patterning thereby to improve yield. <P>SOLUTION: An inner diameter d11 of a printed substrate penetration part 11h of a through via 17 and an inner diameter d15 (of a silk layer penetration part 15h) of a through via 17 of a silk printing layer 15(16) are set at identical diameters. On the other hand, an inner diameter d13 (of a solder resist penetration part 13h) for a through via 17 of a solder resist layer 13(14) are set wider than a via diameter d11. According to the above-described relationship, a part of the silk printing layer 15 forms a silk printing layer extension structure directly formed on a copper pattern 12 in a region near the through via 17. <P>COPYRIGHT: (C)2013,JPO&INPIT |
