发明名称 EPOXY RESIN COMPOSITION AND PRINTED BOARD OBTAINED USING SAME
摘要 <p>The present invention is: an epoxy resin composition containing an epoxy resin, a curing agent, and a reactive flame retardant, the epoxy resin composition characterized in that the curing agent is a biphenylene aralkyl-type phenol resin represented by formula (I); and a printed wiring board obtained using the epoxy resin composition. (In formula (I), m is an integer 0-400; and X1-X4 are each independently a hydrogen atom or a C1-10 alkyl group.)</p>
申请公布号 WO2013038602(A1) 申请公布日期 2013.03.21
申请号 WO2012JP05308 申请日期 2012.08.24
申请人 ADEKA CORPORATION;MORI, TAKAHIRO;KASHIWAZAKI, FUMITO;SAIO, YOSHIHIDE;KIKUCHI, TAKAAKI;TAKAHATA, YOSHINORI 发明人 MORI, TAKAHIRO;KASHIWAZAKI, FUMITO;SAIO, YOSHIHIDE;KIKUCHI, TAKAAKI;TAKAHATA, YOSHINORI
分类号 C08G59/40;H05K1/03 主分类号 C08G59/40
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