| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer on which an identification mark indicating the crystal orientation of the wafer is formed without cutting off or notching the wafer periphery and to provide an identification mark forming method. <P>SOLUTION: A wafer made of a crystal includes a device forming region where a device is formed on the surface, and a circumferential excessive region where the device forming region is surrounded. Inside a wafer in the circumferential excessive region, an identification mark is formed which indicates the crystal orientation of the wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
