发明名称 CUTTING PROCESS AND CUTTING DEVICE
摘要 In a process for cutting a work piece 10 by irradiating a front surface 11 of the work piece 10 with first heating light 43 and second heating light 44 and moving the irradiation regions 100 and 200 of each light along a planned cutting line 12 on the front surface 11, the first heating light 43 has a width W1 extending in a direction orthogonal to the moving direction thereof on a certain area of the front surface 11, the width of the first heating light being set so as to be smaller than a width W2 of the second heating light 44 extending in a direction orthogonal to the moving direction of the second heating light, and the irradiation region 100 of the first heating light 43 being moved in tandem with the irradiation region 200 of the second heating light 44, which precedes the first irradiation region.
申请公布号 US2013068737(A1) 申请公布日期 2013.03.21
申请号 US201213676488 申请日期 2012.11.14
申请人 COMPANY, LIMITED ASAHI GLASS;ASAHI GLASS COMPANY, LIMITED 发明人 SAITO ISAO
分类号 B23K26/38 主分类号 B23K26/38
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