DICING SHEET SUBSTRATE FILM AND DICING SHEET

摘要

Provided is a dicing sheet substrate film which, without requiring additional physical energy such as an electron beam or gamma rays, can reduce dicing debris generated during dicing of an object being cut. This dicing sheet substrate film (2) is provided with a resin layer (A). The resin layer (A) contains a ring-containing resin (a1) which is a thermoplastic resin having, as a structural unit, monomers having at least one of an aromatic ring or an aliphatic ring, and an acyclic olefin resin (a2) which is an olefin-based thermoplastic resin other than the ring-containing resin (a1), wherein the content of the ring-containing resin (a1) in the resin layer (A) is greater than 3.0 mass%. Also provided is a dicing sheet (1) which is provided with the dicing sheet substrate film and an adhesive layer (3) arranged on said film.