发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME |
摘要 |
Provided is a method of manufacturing a circuit which includes: (a) providing a substrate made of a conductive material; (b) etching a first surface of the substrate excluding a region in which at least one via is to be formed; (c) etching a region of the etched first surface of the substrate in which an insulated portion of a first circuit is to be formed; (d) stacking a first insulation layer in spaces formed by the etching performed in operations (b) and (c); and (e) grinding a second surface of the substrate to expose the first insulation layer outward along with the first circuit, thereby forming a circuit board. |
申请公布号 |
US2013068510(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201213589635 |
申请日期 |
2012.08.20 |
申请人 |
KWON SOON CHUL;LEE SANG MIN;SAMSUNG TECHWIN CO., LTD. |
发明人 |
KWON SOON CHUL;LEE SANG MIN |
分类号 |
H01B13/00;H05K1/05 |
主分类号 |
H01B13/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|