| 摘要 |
<p>Provided are an inductor element and a method of manufacturing same whereby it is possible to implement an open magnetic circuit while carrying out an inter-layer connection with a via hole. Sandwiching a magnetic ferrite layer (13) with a high thermal expansion coefficient between a non-magnetic ferrite layer (12) and a non-magnetic ferrite layer (14) with low thermal expansion coefficients gives rise to cracks (51) in the peripheries of via holes (21) from compression stress caused by a constriction difference when firing temperatures fall. Conductors (silver) of the via holes (21) have the highest thermal expansion coefficients; hence, the cracks are most likely to arise in the peripheries of the via holes (21). Accordingly, forming the via holes (21) in locations near the end faces of the magnetic ferrite layer (13) causes the cracks (51) to arise so as to connect the via holes (21) with the end faces of the magnetic ferrite layer (13). It is thus possible to magnetically neutralize the end face sides of the magnetic ferrite layer (13), and to obtain a practical open magnetic circuit, with the cracks (51).</p> |
