| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an array detection method capable of detecting chip array even on a wafer of large chip in a prober, with reduced burden on an operator. <P>SOLUTION: In a prober, each terminal of a tester is connected to an electrode of a chip for electrically inspecting operation of the chip formed regularly on a wafer W. A method of detecting chip array on a wafer loaded on a wafer stage includes the steps of :(S13) detecting a center position of a wafer; (S15) imaging a surface image of the wafer by a plurality of times using a wafer alignment camera while changing a relative position, and compositing the imaged images to generate a surface image within a predetermined range from the center position of the wafer; (S16) displaying a composite wafer surface image so that the entire predetermined range is displayed; (S17) registering an intersection of an instructed street; (S19) registering an alignment mark in the chip that is instructed; and detecting an alignment mark of a different chip and calculating chip array from positional relationship. <P>COPYRIGHT: (C)2013,JPO&INPIT |
