发明名称 |
ANISOTROPIC CONDUCTIVE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND CONNECTION STRUCTURE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material capable of effectively removing a binder resin between a conductive particle and an electrode and enhancing conduction reliability when used for electrical connection between electrodes. <P>SOLUTION: An anisotropic conductive material contains a conductive particle 1 and a binder resin. The conductive particle 1 includes: a base particle 2; a first solder layer 4 disposed on a surface 2a of the base particle 2; and a second solder layer 5 laminated on a surface 4a of the outside of the first solder layer 4. The content of an oxygen atom in 100 wt% of the second solder layer 5 is larger than that of the oxygen atom in 100 wt% of the first solder layer 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013054850(A) |
申请公布日期 |
2013.03.21 |
申请号 |
JP20110190698 |
申请日期 |
2011.09.01 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
SAITO SATOSHI;KOBAYASHI HIROSHI |
分类号 |
H01B1/20;H01B1/00;H01B5/16;H01B13/00;H01R11/01;H05K3/32 |
主分类号 |
H01B1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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