发明名称 ANISOTROPIC CONDUCTIVE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material capable of effectively removing a binder resin between a conductive particle and an electrode and enhancing conduction reliability when used for electrical connection between electrodes. <P>SOLUTION: An anisotropic conductive material contains a conductive particle 1 and a binder resin. The conductive particle 1 includes: a base particle 2; a first solder layer 4 disposed on a surface 2a of the base particle 2; and a second solder layer 5 laminated on a surface 4a of the outside of the first solder layer 4. The content of an oxygen atom in 100 wt% of the second solder layer 5 is larger than that of the oxygen atom in 100 wt% of the first solder layer 4. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013054850(A) 申请公布日期 2013.03.21
申请号 JP20110190698 申请日期 2011.09.01
申请人 SEKISUI CHEM CO LTD 发明人 SAITO SATOSHI;KOBAYASHI HIROSHI
分类号 H01B1/20;H01B1/00;H01B5/16;H01B13/00;H01R11/01;H05K3/32 主分类号 H01B1/20
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