| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure capable of preventing occurrence of breakage, deflection, distortion, or the like of an electrostatic chuck body which is caused by thermal stress by absorbing thermal expansion difference between the electrostatic chuck body and a base during use in a wafer process at a high temperature. <P>SOLUTION: An electrostatic chuck body 11 is fixed to a base (water cooling plate 20) for no mobility at a fixing point on an outside peripheral edge of an electrostatic adsorption surface 12 thereof, and is connected to the base so as not to be slidably moved at a movable point away from the fixing point. As a result, thermal expansion of the electrostatic chuck body is absorbed when an electrostatic chuck device 10 is used in a wafer process at a high temperature, causing no occurrence of breakage, deflection, distortion, or the like. As one example, a movable post 26 fixed to the electrostatic chuck body is inserted slidably in a slot (through hole 23) of the base. Since a predetermined height distance is maintained between the electrostatic chuck body and the base, an intermediate component such as a reflector can be arranged between them. <P>COPYRIGHT: (C)2013,JPO&INPIT |
