| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device capable of stably keeping conduction between an electronic component and an external electrode, and easily forming a through electrode. <P>SOLUTION: A manufacturing method of an electronic device includes the steps of: (a) forming a hollow on either of upper and lower surfaces of a base material 9; (b) filling the hollow with a plating layer 21 by performing via-fill plating processing for the hollow; and (c) forming a base 10 having a through electrode 20 composed of a plating layer 21 on a base material 9 after polishing by polishing the base material 9 so that at least a bottom surface of the hollow is exposed outside. <P>COPYRIGHT: (C)2013,JPO&INPIT |
