发明名称 |
DIE SUBSTRATE WITH REINFORCEMENT STRUCTURE |
摘要 |
Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate. |
申请公布号 |
US2013069250(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201213671727 |
申请日期 |
2012.11.08 |
申请人 |
TOPACIO RODEN;ZBRZEZNY ADAM |
发明人 |
TOPACIO RODEN;ZBRZEZNY ADAM |
分类号 |
H01L23/48;H01L21/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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