SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE
摘要
Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
申请公布号
WO2012148859(A3)
申请公布日期
2013.03.21
申请号
WO2012US34702
申请日期
2012.04.23
申请人
APPLIED MATERIALS, INC.;ZHANG, HUANBO;SIN, GARRETT HO YEE;HEUNG, KING YI;BOHANNON, NATHAN;ZHANG, QING
发明人
ZHANG, HUANBO;SIN, GARRETT HO YEE;HEUNG, KING YI;BOHANNON, NATHAN;ZHANG, QING