发明名称 SUBSTRATE SUPPORT WITH SUBSTRATE HEATER AND SYMMETRIC RF RETURN
摘要 Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a substrate support surface and a shaft; an RF electrode disposed in the substrate support proximate the substrate support surface to receive RF current from an RF source; a heater disposed proximate the substrate support surface to provide heat to a substrate when disposed on the substrate support surface, the heater having one or more conductive lines to provide power to the heater; a thermocouple to measure the temperature of a substrate when disposed on the substrate support surface; and a conductive element having an interior volume with the one or more conductive lines and the thermocouple disposed through the interior volume, the conductive element coupled to the RF electrode and having an electric field of about zero in the interior volume when RF current is provided to the conductive element.
申请公布号 WO2013003266(A3) 申请公布日期 2013.03.21
申请号 WO2012US43967 申请日期 2012.06.25
申请人 APPLIED MATERIALS, INC.;CHANG, YU;TZU, GWO-CHUAN;CUI, ANQING;KUANG, WILLIAM W.;CUVALCI, OLKAN 发明人 CHANG, YU;TZU, GWO-CHUAN;CUI, ANQING;KUANG, WILLIAM W.;CUVALCI, OLKAN
分类号 H01L21/205;H01L21/3065;H01L21/683 主分类号 H01L21/205
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