发明名称 METHOD FOR PROCESSING HARD SUBSTRATE LAMINATED BODY, AND CLAMP JIG
摘要 <p>Provided is a method for satisfactorily suppressing erosion of the surface layer by the etching liquid when an outer profile processing is performed on a hard substrate laminated body such as a glass substrate by etching, and efficiently processing the hard substrate laminated body such as a glass substrate. A method for processing a hard substrate laminated body, including: a step of readying a hard substrate laminated body obtained by bonding two or more hard substrates using an adhesive, at least one of the hard substrates being provided on the substrate surface with one or more layers selected from the group consisting of a metal layer, a resin layer, a silica layer, an organosilicate layer, and a transparent electrode layer, the hard substrate laminated body being subjected to predetermined chamfering; and a step of immersing the chamfered hard substrate laminated body in the etching liquid and performing etching in a state in which the laminated body is held by a clamp jig which presses the entirety of both surfaces of the laminated body in the thickness direction.</p>
申请公布号 WO2013039231(A1) 申请公布日期 2013.03.21
申请号 WO2012JP73719 申请日期 2012.09.14
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA;EDA,YUKIO;TAKEMA,JUNICHIRO;KURIMURA,HIROYUKI;IBAYASHI,TOSHIYUKI 发明人 EDA,YUKIO;TAKEMA,JUNICHIRO;KURIMURA,HIROYUKI;IBAYASHI,TOSHIYUKI
分类号 C03C15/00;C03C27/10;G09F9/00 主分类号 C03C15/00
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