SYSTEM FOR GRINDING/POLISHING HARD AND BRITTLE MATERIALS, AND GRINDING/POLISHING METHOD

摘要

Provided is a system for grinding/polishing hard and brittle materials, said system being provided with a grinding function for making cross-sectional dimensions of a subject to be processed composed of hard and brittle materials within a tolerance range, and a polishing function for removing microcracks of a surface layer of the subject that has been ground, and reducing surface roughness to be small. Also provided is a method for grinding/polishing the hard and brittle materials. The grinding/polishing system is provided with: a grinding apparatus (1), which grinds a surface layer portion of a subject (W) to be processed that is composed of hard and brittle materials, removes impurities and strain in the columnar axis direction from the surface layer portion of the subject, and makes a cross-section have desired dimensions; a polishing apparatus (2), which polishes recesses and projections of the surface layer portion of the subject which has been ground, removes microcracks of the surface layer portion of the subject, and reduces the surface roughness to be small; and a control means, which performs arithmetic processing on the basis of initially set items, and measurement signals obtained from the grinding apparatus and the polishing apparatus, and outputs operation signals to the grinding apparatus and the polishing apparatus.