发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To enable component supply wagons to be exchanged during the operation of a facility while ensuring the safety of workers with an inexpensive system in an electronic component mounting apparatus which can attach/detach the component supply wagons thereto/therefrom. <P>SOLUTION: An apparatus body 1a has an opening 29, which allows a gantry moving space 26a in a cover 27 to communicate with a wagon housing space 25a, and the opening 29 may be closed by a gantry 26 located at a component take-out position where components are taken out from a component supply wagon 31. In the apparatus body 1a, a first sensor 36 for detecting that the gantry 26 closes the opening 29, and second sensors 37, 38, 39 for detecting that the component supply wagon 31 is housed in the wagon housing space 25a, are provided. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013055220(A) 申请公布日期 2013.03.21
申请号 JP20110192459 申请日期 2011.09.05
申请人 SAMSUNG TECHWIN CO LTD 发明人 OGATA YUJI
分类号 H05K13/04 主分类号 H05K13/04
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