发明名称 WIRE COATED WITH SOLID MICROPARTICLES, AND METHOD FOR PRODUCING WIRE COATED WITH SOLID MICROPARTICLES
摘要 <p>The purpose of this invention is to provide a durable, high-performance wire coated with solid microparticles, the wire allowing solid microparticles such as diamond particles to be affixed to the wire in a stable manner; and to provide a method for producing the wire coated with solid microparticles. In order to achieve this objective, there is provided a wire coated with solid microparticles or the like in which the solid microparticles are affixed to the outer peripheral surface of the wire, wherein the wire or the like coated with solid microparticles is characterized that the surface of the wire is provided with: a nickel electroplating layer containing solid microparticles, the microparticles being dispersed, surface-modified solid microparticles with an inorganic coating layer; and a nickel plating overcoat layer on the surface of the nickel electroplating layer containing solid microparticles.</p>
申请公布号 WO2013039097(A1) 申请公布日期 2013.03.21
申请号 WO2012JP73304 申请日期 2012.09.12
申请人 FACILITY CO., LTD.;KISHI, KAZUYUKI;MITSUI, HIDEO 发明人 KISHI, KAZUYUKI;MITSUI, HIDEO
分类号 B24D11/00;B24B27/06;B24D3/00 主分类号 B24D11/00
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