| 发明名称 |
Single-layer metallization and via-less metamaterial structures |
| 摘要 |
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures. |
| 申请公布号 |
KR101246173(B1) |
申请公布日期 |
2013.03.21 |
| 申请号 |
KR20107011755 |
申请日期 |
2008.10.13 |
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发明人 |
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| 分类号 |
H01Q1/38;H01Q5/02;H01Q21/00 |
主分类号 |
H01Q1/38 |
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