| 摘要 |
PURPOSE: A substrate manufacturing method and a manufacturing method of a wiring board are provided to efficiently manufacture a wiring board using a glass substrate as a core substrate by reducing time to fill a penetration hole. CONSTITUTION: A glass substrate is prepared on a glass base(S10). A metallic plating base layer is formed in a first side of the glass plate(S20). By forming the first metallic material layer in the first side of the glass plate, a first opening of a penetration hole is closed by the first metallic material(S30). By accumulating a second metallic material in the penetration hole, the penetration hole is filled with metal(S40). [Reference numerals] (S10) First process: substrate preparing process; (S11) Through hole forming step; (S12) Glass substrate modifying step; (S13) Wall surface roughing step; (S20) Second process: metallic plating base layer forming process; (S30) Third process: opening closing process; (S40) Fourth process: metal filling process; (S50) Fifth process: substrate surface processing process; (S51) Substrate surface exposing step; (S52) Substrate flattening step; (S60) Sixth process: wiring pattern forming process; (S61) Adhesion layer forming step; (S62) Wiring layer forming step; (S63) Patterning step
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