| 摘要 |
<p>Provided are: a positive electrode for electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein the positive electrode has a lower electric potential, and the electrolysis voltage and basic units of electrical energy can be reduced in comparison to a conventional positive electrode, and which is low-cost and can be used as a positive electrode for electrolytic plating for a variety of types of metals; and an electrolytic plating method in which an aqueous solution serves as the electrolytic solution, wherein the electrical potential of the positive electrode and the electrolytic voltage are lower and the basic units of electrical energy can be reduced. This positive electrode for electrolytic plating is used in electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein a catalyst layer comprising amorphous ruthenium oxide and amorphous tantalum oxide has been formed atop an electroconductive substrate.</p> |
