发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE MOLD AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a top integrated circuit on a first side of the substrate; mounting a bottom integrated circuit on a second side of the substrate; forming a top encapsulation over the top integrated circuit and a bottom encapsulation over the bottom integrated circuit simultaneously; and forming a bottom via through the bottom encapsulation to the substrate.
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申请公布号 |
US2013069240(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201113235202 |
申请日期 |
2011.09.16 |
申请人 |
YANG DEOKKYUNG;CHOI DAESIK |
发明人 |
YANG DEOKKYUNG;CHOI DAESIK |
分类号 |
H01L23/538;H01L21/56 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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