| 摘要 |
<p>In manufacture of a light emitting element package formed by covering an upper surface of an LED element with a resin containing a fluorescent material, at the time of supplying the resin by discharging the resin to the LED element in the wafer state, excitation light is applied from a light source unit to a light transmitting member to which the resin is supplied in trial for the purpose of measuring light emitting characteristics, and the light emitting characteristics of light emitted from the resin are measured, and on the basis of the measurement results and previously specified light emitting characteristics, a suitable resin supply quantity is corrected, and the suitable resin supply quantity of the resin to be supplied to the LED element for the purpose of actual manufacture is derived.</p> |
