METAL FILLING APPARATUS

摘要

The present invention pertains to a metal filling apparatus which enables the thickness of a layer comprising surplus metal formed on an object to be processed to be formed to a minimum thickness after processing, and enables minute spaces (vias and through-holes), which are formed in such a manner as to provide openings in an object to be processed, to be filled with molten metal. The metal filling apparatus (1) is provided with a holding base (H) that holds a semiconductor wafer, and a piston (P) that is disposed so as to face the holding base (H), upon which a pressing part comprising metal is formed on the side facing the holding base (H). The metal filling apparatus (1) is further provided with a pressing mechanism (5) or the like, which is disposed in such a manner as to be capable of pressing the piston (P) against the semiconductor wafer (K), which is held by the holding base (H). An airtight processing compartment (2) is formed by the semiconductor wafer (K), which is held by the holding base (H), a housing (C) and the piston (P). In addition, the metal filling apparatus (1) is provided with a decompression mechanism (3) that discharges gas inside the processing compartment (2) and reduces the pressure inside the processing compartment (2), a molten metal supply mechanism (4) that supplies molten metal (M) inside the processing compartment (2), a pressurized gas supply mechanism (7) that supplies an inert gas inside the processing compartment (2), and the like.