发明名称 |
THERMAL TREATMENT APPARATUS, TEMPERATURE CONTROL SYSTEM, THERMAL TREATMENT METHOD, TEMPERATURE CONTROL METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM EMBODIED WITH PROGRAM FOR EXECUTING THE THERMAL TREATMENT METHOD OR THE TEMPERATURE CONTROL METHOD |
摘要 |
PURPOSE: A thermal treatment apparatus, a temperature control system, a thermal treatment method, a temperature control method, and a readable medium having a program for executing the thermal treatment method or the temperature control method are provided to save power consumption. CONSTITUTION: A substrate holding part(44) supports substrates at regular intervals. The substrates are arranged in a process chamber(65). A heating part(63) heats the process chamber. A feeding part(91) supplies gas. A cooling part(90) cools the process chamber.
|
申请公布号 |
KR20130029009(A) |
申请公布日期 |
2013.03.21 |
申请号 |
KR20120094300 |
申请日期 |
2012.08.28 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
YOSHII KOJI;YAMAGUCHI TATSUYA;WANG WENLING;SAITO TAKANORI |
分类号 |
H01L21/205;H01L21/02;H01L21/22 |
主分类号 |
H01L21/205 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|