DEVICE PROTOCOL TRANSLATOR FOR CONNECTION OF EXTERNAL DEVICES TO A PROCESSING UNIT PACKAGE

摘要

A processing unit package includes a processing unit disposed on an interposer and a device protocol translator disposed on the interposer. Through-silicon vias (TSVs) may be used to provide connections from the device protocol translator through the interposer to an external device. The device protocol translator uses a controller to control a plurality of buffers that store information received from respective information buses coupled to the processing unit, such that the processing unit information is translated according to a protocol of the external device.