发明名称 |
ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND RESIST CROSS-LINKING DURING EVAPORATION |
摘要 |
Disclosed herein are systems and methods for in-situ measurement of impurities on metal slugs utilized in electron-beam metal evaporation/deposition systems, and for increasing the production yield of a semiconductor manufacturing processes utilizing electron-beam metal evaporation/deposition systems. A voltage and/or a current level on an electrode disposed in a deposition chamber of an electron-beam metal evaporation/deposition system is monitored and used to measure contamination of the metal slug. Should the voltage or current reach a certain level, to the deposition is completed and the system is inspected for contamination. |
申请公布号 |
US2013069622(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201213678765 |
申请日期 |
2012.11.16 |
申请人 |
SKYWORKS SOLUTIONS, INC.;SKYWORKS SOLUTIONS, INC. |
发明人 |
CHENG KEZIA |
分类号 |
G01N27/00;H01L21/02 |
主分类号 |
G01N27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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