| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrically insulating resin composition excellent in heat conductivity, heat resistance, adhesion properties, and electrical insulation properties as printed wiring boards for LED and various electronic circuits; and to provide a metal substrate using the resin composition. <P>SOLUTION: The electrically insulating resin composition comprises an epoxy resin, a polycarbodiimide resin, a curing agent, an inorganic filler, and an organopolysiloxane. An electrically insulating resin layer of the metal substrate is obtained by using the electrically insulating resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
