| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an evaporation apparatus and a thin film forming method, capable of improving uniformity of thin film thickness even when an object to be evaporated is large. <P>SOLUTION: The evaporation apparatus is used to form a uniform thin film, even for a large substrate, and can be easily employed without changing equipment even if a size of the substrate is changed. The evaporation apparatus includes: a first evaporation source provided so as to perform a linear movement; a second evaporation source separated from the first evaporation source and provided so as to perform a linear movement simultaneously with the first evaporation source in the same direction; and a compensation member located between an object to be evaporated and the first and second evaporation sources, and provided so as to perform a linear movement simultaneously with the first and second evaporation sources in the same direction. The compensation member includes a first compensation plate provided in a position corresponding to the first evaporation source, and a second compensation plate provided in a position corresponding to the second evaporation source. <P>COPYRIGHT: (C)2013,JPO&INPIT |
