发明名称 ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULE
摘要 An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.
申请公布号 US2013070419(A1) 申请公布日期 2013.03.21
申请号 US201213483305 申请日期 2012.05.30
申请人 YANG CHIH-HAO;ZENG XIANG-KUN;HAO CHENG;LU ER-WEI;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 发明人 YANG CHIH-HAO;ZENG XIANG-KUN;HAO CHENG;LU ER-WEI
分类号 H05K7/20 主分类号 H05K7/20
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